Networking/telecommunication applications typically have the greatest demands in terms of performance, reliability, and capacity. ATP provides industry leading production level TDBI (Test During Burn In) capability and utilizes specific in-house testing solution to ensure long-term reliability and quality of ATP industrial grade DRAM products which can operate under extreme temperature conditions.
Furthermore, networking/telecommunication environments usually have high traffic with multiple concurrent transactions. ATP engineered industrial Grade SSDs and embedded SSD modules offer a wide range of capacities and increase the performance in IOPS with full power failure protection technologies.
ATP satisfies customers not only with its technological advancements, but also its broad processor/chipset compatibility (for DRAM products), supply chain longevity, logistic flexibility and strong engineering supports.