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M.2 Embedded SSD drive

M.2 SSD

Key features
  • M.2 Specification v1.0 Defined by PCI-SIG
  • Built-in hardware-based data protection technology during power failure - PowerProtector
  • Ultra high performance solution for small form factor embedded and industrial applications
  • Supports S.M.A.R.T. ATA feature set
  • RoHS compliant and CE/FCC certifation

The ATP M.2 2242/2260/2280 Embedded SSD is the Next GenerationForm Factor (NGFF) storage solution. It provides outstanding performance and proven reliability for product operation,which is perfect for networking and thin clients, also suitable for enterprise storage systems  consistent data integrity requirement such as POS, industrial computers, and data center applications.

Product Name

M.2  2242 D2-B-M

M.2 2260 D2-B-M M.2 2280 D2-B-M
Flash Type SLC iTemp MLC MLC SLC iTemp MLC MLC iTemp MLC MLC
Density 8GB to 64GB 32GB to 128GB 32GB to 128GB 64GB to 256GB 128GB to 512GB
Performance

Sequential Read up to 530MB/s

Sequential Write up to 400MB/s

Sequential Read up to 520MB/s

Sequential Write up to 150MB/s

Sequential Read up to 530MB/s

Sequential Write up to 390MB/s

Sequential Read up to 530MB/s

Sequential Write up to 310MB/s

Sequential Read up to 530MB/s

Sequential Write up to 440MB/s

Random Read IOPS up to 76,000 Random Read IOPS up to 67,800 Random Read IOPS up to 76,000 Random Read IOPS up to 70,000 Random Read IOPS up to 71,000
Interface SATA III 6 Gb/s
Operating
Temperature
-40°C to +85°C -40°C to +85°C 0°C to 70°C -40°C to +85°C -40°C to +85°C 0°C to 70°C -40°C to +85°C 0°C to 70°C
Reliability Advanced Wear Leveling , AutoRefresh, PowerProtector
TBW* (max.) : 5333.33 TB TBW* (max.) :266.67 TB

TBW* (max.) : 320 TB

TBW* (max.) : 10,666.67 TB

TBW* (max.) : 533.33TB

TBW* (max.) : 640 TB

TBW* (max.) : 1066.6 TB TBW* (max.) : 1280 TB
MTBF @ 25°C: >2,000,000 hours

Dimensions: LxWxH (mm)

42.0 X 22.0 X 3.5

60.0 X 22.0 X 3.5

80.0 X 22.0 X 3.5

*All TBW data listed are under highest sequential write value in each product line.

The TBW data are subject to change by density, configuration and customers's applications.

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