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ATP Goes Full Throttle on IIoT's Data-Driven Industrial Evolution with iTemp NVMe™, 3D NAND, DRAM at Embedded Systems Expo (ESEC Spring) Japan

2018-04-20Back

ATP Goes Full Throttle on IIoT's Data-Driven Industrial Evolution
with iTemp NVMe™, 3D NAND, DRAM at Embedded Systems Expo (ESEC Spring) Japan

High-Speed, Reliable Storage and Memory Solutions
Blaze Through Industrial/Embedded Applications

 

Taipei, Taiwan (May 2018) – ATP Electronics, a leading manufacturer of high-performance industrial memory and storage solutions, is full speed ahead in meeting the data storage challenges of the IIoT age with its fast iTemp NVMe SSDs, reliable 3D NAND-based memory cards and rugged DRAM for industrial and embedded applications at the Embedded Systems Expo (ESEC Spring) in Japan from May 9 to 11, 2018.

ESEC Spring is expecting about 91,000 visitors and 1,800 exhibitors at the iconic Tokyo Big Sight,

with ATP Electronics booth located at West 11-76.

Japan’s significant role in the embedded and industrial market highlights the importance of the Embedded Systems Expo (ESEC Spring) as a gathering of powerhouse technological innovators," said Marco Mezger, ATP Vice President of Global Marketing. He added, "ATP's staunch dedication to quality upholds the standards of manufacturing excellence that Japan is widely commended for, and this is a brilliant platform to introduce ATP's latest memory and flash storage solutions engineered for embedded applications in the ongoing industrial evolution."

iTemp M.2 NVMe for the Smart Factory

Large-scale networks of machines, humans and virtually anything interconnected to one another are ushering in a new era of unprecedented productivity, automation and communication. Commonly referred to as the Industrial Internet of Things (IIoT), this phenomenon is enabling extensive deployments of smart systems and sensors that generate, collect and analyze massive amounts of data in real-time to improve manufacturing processes and ensure a more productive future.

ATP's industrial temperature-rated M.2 NVMe drives fulfill the need for high-speed, high-density, and high-performance storage in the smart factory. Perfect for compact and fanless embedded systems, these NVMe drives can perform dependably in tough environments within a wide temperature range of -40°C to 85°C. ATP NVMe SSDs feature ATP Dynamic Thermal Throttling, which intelligently keeps the system cool without drastically impacting performance. ATP NVMe SSDs have been found to perform two to three times better than other brands even with Dynamic Throttling activated while operating at full strength.

ATP’s iTemp NVMe SSDs come in M.2 2280 form factor with densities up to 1 TB. They are designed for a PCIe® Generation 3.0 x4 lane high-speed interface, delivering a bandwidth of up to 32 Gb/s (8 Gb/s per lane), which is four to six times the data transfer speed of previous-generation AHCI protocol on Serial ATA drives.

3D NAND-Based Memory Cards for Automotive Applications

ATP is among the first manufacturers to implement 3D NAND technology on industrial-grade memory cards, achieving high densities with better endurance due to less cell-to-cell interference. Specifically built to withstand the rigors of automotive applications, ATP SD/microSD memory cards perform reliably under extremely low or high temperatures; endure vibration/shock; and repel dust, water, electrostatic discharge (ESD) and electromagnetic interference (EMI). They are ideal for in-vehicle infotainment (IVI), event data recording, Advanced Driver Assistance Systems (ADAS), and other applications requiring high performance, capacity, reliability and endurance. Random read-write performance complies with SDA A1 specifications and is currently among the highest available today.

Tough-Performing DRAM Modules for Tough Environments

The increasingly connected world requires reliable memory to ensure maximum uptime for mission-critical applications. ATP DRAM modules are engineered for the most demanding industrial computing scenarios. Conformal coating covers all components and points of failure with a protective layer of Parylene to shield against dust, chemicals, moisture and corrosion. The 30µ"-thick gold finger plating ensures module strength and quality signal transmission between the connector and DRAM module. Anti-sulfur resistors (optional) protect the module from the damaging effects of sulfur contamination. Wide (-40°C to 85°C) or extended (-40°C to 95°C) temperature support is available on a project basis to ensure the long-term stability of systems installed in environments with fluctuating or extreme temperatures.

ATP is enabling the transformation of a connected world and providing solutions for a more productive, data-intensive future. All ATP products are designed, thoroughly tested and manufactured in its purpose-built factory. Visit the ATP booth at West 11-76.

For inquiries, please contact ATP regional sales, distributors, or send an email to Info@atpinc.com.

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